- Joined
- Feb 6, 2001
- Messages
- 3,621
This is one of those "I need to know" questions. I know folks that just spray their solder joints with windex w/ ammonia (like damascus etching), I know folks that sprinkle baking soda over the solder joints (with and without windex) and leave them for awhile and the one I started doing awhile back (thanks to this forum) is boiling the joint in baking soda and water. What the heck is the difference between methods? Which is better in your opinion? And how the heck does the boiling get trapped flux out of a lump of solder? This one's been bugging me for awhile.



