Yes, and this might make sense, but he also mentions a number of places that with epoxy, you want as thin a layer as possible. This is to minimize the number of defects (air bubbles, dust. etc) that could lead to failure of the bond. Having holes in the tang, while possibly adding the number of undercuts (it's hard to sand these holes), will also leave a large deposit of epoxy that could/will have above mentioned defects.
In post #40 of the thread:
So to me, drilling holes won't make the bond stronger, but might make it weaker.
Another thing one would need to think about if trying to increase the contact points for epoxy is the size of the holes and thickness of the tang. Let's say a 1/4" hole in 1/8" thick tang. The area of the circle is 0.049" x 2 sides for a total surface area for epoxy of 0.098 square inches. The circumference of the hole is 0.785", multiplied by the thickness 0.125" for a total surface area of 0.098 square inches. hmmm...is there a formula for this??? It looks like if the radius of the hole is larger than the tang thickness, then you actually have less surface area for the epoxy to bond to than if you didn't drill the holes.
Hopefully a math wizard will check my work.