I am using PCB powder to prevent decarburization during HT.
Normally I grind my O-1 blades to 400 before HT.
The problem with PCB is that sometimes I get spot or two that are not covered and I have ugly decarb on my O-1. This is with two or sometimes tree layers of PCB! I suspect when PCB melt it just slides of some smooth points.
I could grind only to 120 grid to improve PCB "stickage" but that kind of defeat purpose of PCB to minimize grinding after HT.
Any tips for me, guys? Is there any stuff I can put on my blade prior to PCB to improve adherence?
Normally I grind my O-1 blades to 400 before HT.
The problem with PCB is that sometimes I get spot or two that are not covered and I have ugly decarb on my O-1. This is with two or sometimes tree layers of PCB! I suspect when PCB melt it just slides of some smooth points.
I could grind only to 120 grid to improve PCB "stickage" but that kind of defeat purpose of PCB to minimize grinding after HT.
Any tips for me, guys? Is there any stuff I can put on my blade prior to PCB to improve adherence?